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Engineering Physics

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Morphology of Nanostructure and Properties of Silver-Carbon-Copper Electroexplosive Coating After Pulsed Electronic Processing
Romanov D.A., Moskovsky S.V., Pochetukha V.V., Vashchuk E.S., Ivanov Yu.F.

The silver-carbon coating is formed on copper using an electroexplosive method and subsequent
pulsed electronic processing. The thickness of the coating after the fi rst treatment varies from
50 microns to 550 microns. Carbon graphite fi ber in the coating is present in the form of plates.
There are also copper atoms in the coating, the concentration increases from the surface to the
base. The formation of interstitial solid solutions based on copper and silver was discovered by
X-ray phase analysis. Studies using micro-X-ray spectral analysis of foils for transmission electron
microscopy have shown that copper in the coating is located in the form of thin layers along the
boundaries of silver grains, or forms inclusions (grains) of submicrocrystalline sizes. It has been
established that graphite is present in the form of nanosized (10-15 nm) particles in the volume of
silver grains and copper grains, and is also located at the boundaries of silver grains. In the Ag–C/
Cu system, the formation of a transition layer with a thickness of 250–300 nm was revealed. The size
of subgrains in the transition layer varies within the range of 150–250 nm. The elastic modulus and
Vickers microhardness decrease with increasing coating depth. The wear resistance of the coating is
6∙10–6 mm3
/N∙m. The resulting set of properties and characteristics of the structure allows us to draw
a conclusion about the suitability of the formed coatings for use in electrical contacts of high-power
electrical networks. The specifi c choice of a specifi c contact model requires additional clarifying
studies.
Keywords: electro-explosive coating, silver, carbon-graphite fi ber, copper, nano-sized particles, hardness, Young's modulus,
wear resistance, pulsed electron beam processing.


DOI: 10.25791/infi zik.1.2024.1379

Pp. 20-31.

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